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Início > Produtos > Ventiladores, Sopradores, Gerenciamento Térmico > Térmico > Dissipadores de Calor

Dissipadores de Calor

Nº da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Série	Embalagem	Status do produto	Tipo	Pacote resfriado	Método de fixação	Forma	Comprimento	Largura	Diâmetro	Altura da aleta	Dissipação de energia @ Aumento de temperatura	Resistência térmica @ Fluxo de ar forçado	Resistência térmica @ Natural	Material	Acabamento do material
507002B00000G HEATSINK TO-220 BLK Boyd Laconia, LLC	866	-	RFQ	Ficha técnica	Hat Section 5070	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.700" (17.78mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	15.60°C/W	Aluminum	Black Anodized
V5618B HEATSINK ALUM ANOD Assmann WSW Components	617	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	14-DIP and 16-DIP	Press Fit	Rectangular, Fins	0.748" (19.00mm)	0.250" (6.35mm)	-	0.189" (4.80mm)	-	-	46.00°C/W	Aluminum	Black Anodized
634-10ABPE HEATSINK TO-220 VERT MT BLK 1" Wakefield-Vette	17,022	-	RFQ	Ficha técnica	634	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	0.640" (16.26mm)	-	0.640" (16.26mm)	-	-	-	Aluminum	Black Anodized
7141DG BOARD LEVEL HEATSINK .515"TO-220 Boyd Laconia, LLC	409	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	0.780" (19.81mm)	0.520" (13.21mm)	-	0.515" (13.08mm)	1.0W @ 30°C	10.00°C/W @ 200 LFM	20.30°C/W	Copper	Tin
V5618C HEATSINK ALUM ANOD Assmann WSW Components	400	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	18-DIP	Press Fit	Rectangular, Fins	0.900" (23.00mm)	0.250" (6.35mm)	-	0.189" (4.80mm)	-	-	40.00°C/W	Aluminum	Black Anodized
7-338-1PP-BA HEATSINK PWR W/PINS BLACK TO-220 CTS Thermal Management Products	375	-	RFQ	Ficha técnica	7	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.380" (35.05mm)	-	0.500" (12.70mm)	3.0W @ 40°C	-	12.70°C/W	Aluminum	Black Anodized
647-10ABEP HEATSINK TO-220 W/PINS BLK 1" Wakefield-Vette	1,978	-	RFQ	Ficha técnica	647	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.650" (41.91mm)	1.000" (25.40mm)	-	1.000" (25.40mm)	6.0W @ 42°C	3.80°C/W @ 200 LFM	-	Aluminum	Black Anodized
580200B00000G HEATSINK 14-16 DIP BLK ANODIZED Boyd Laconia, LLC	1,694	-	RFQ	Ficha técnica	-	Bag	Active	Top Mount	14-DIP and 16-DIP	Press Fit, Slide On	Rectangular, Fins	0.890" (22.61mm)	0.600" (15.24mm)	-	0.410" (10.42mm)	1.0W @ 20°C	12.00°C/W @ 200 LFM	20.00°C/W	Aluminum	Black Anodized
HSB36-353510 HEAT SINK, BGA, 35 X 35 X 10 MM, Same Sky (Formerly CUI Devices)	610	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.394" (10.00mm)	5.9W @ 75°C	4.30°C/W @ 200 LFM	12.72°C/W	Aluminum Alloy	Black Anodized
TGH-0130-01 ALUMINIUM HEAT SINK 13X13MM t-Global Technology	6,817	-	RFQ	Ficha técnica	TGH	Bulk	Active	Top Mount	-	-	Square, Fins	0.512" (13.00mm)	0.512" (13.00mm)	-	0.236" (6.00mm)	-	-	-	Aluminum	Clean Anodized
628-65AB HEATSINK CPU 43MM SQ BLK H=.65" Wakefield-Vette	1,181	-	RFQ	Ficha técnica	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.650" (16.51mm)	3.0W @ 20°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
HSB35-272725 HEAT SINK, BGA, 27 X 27 X 25 MM, Same Sky (Formerly CUI Devices)	214	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.984" (25.00mm)	8.6W @ 75°C	2.90°C/W @ 200 LFM	8.74°C/W	Aluminum Alloy	Black Anodized
574102B00000G HEATSINK TO-220 CLIP-ON BLK Boyd Laconia, LLC	3,951	-	RFQ	Ficha técnica	-	Bag	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.750" (19.05mm)	0.860" (21.84mm)	-	0.395" (10.03mm)	1.5W @ 40°C	8.00°C/W @ 500 LFM	23.20°C/W	Aluminum	Black Anodized
HSB19-272718 HEAT SINK, BGA, 27 X 27 X 18 MM Same Sky (Formerly CUI Devices)	490	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.709" (18.00mm)	6.8W @ 75°C	4.50°C/W @ 200 LFM	11.11°C/W	Aluminum Alloy	Black Anodized
TGH-0200-02 ALUMINIUM HEAT SINK 20X20MM t-Global Technology	899	-	RFQ	Ficha técnica	TGH	Bulk	Active	Top Mount	-	-	Square, Fins	0.787" (20.00mm)	0.787" (20.00mm)	-	0.236" (6.00mm)	-	-	-	Aluminum	Black Anodized
7019B-MTG HEATSINK TO-220 TAB FOLD 25.4MM Boyd Laconia, LLC	2,514	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.550" (39.37mm)	-	0.375" (9.52mm)	3.0W @ 40°C	8.00°C/W @ 100 LFM	11.00°C/W	Aluminum	Black Anodized
577404B00000G HEATSINK TO-202 LOW PROFILE .5" Boyd Laconia, LLC	5,333	-	RFQ	Ficha técnica	-	Bag	Active	Board Level	TO-202	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.500" (12.70mm)	2.0W @ 50°C	10.00°C/W @ 200 LFM	24.00°C/W	Aluminum	Black Anodized
634-20ABPE HEATSINK TO-220 VERT MT BLK 2" Wakefield-Vette	47,767	-	RFQ	Ficha técnica	634	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	0.640" (16.26mm)	-	0.640" (16.26mm)	-	-	-	Aluminum	Black Anodized
624-45AB HEATSINK CPU 21MM SQ W/OUT ADH Wakefield-Vette	936	-	RFQ	Ficha técnica	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.450" (11.43mm)	-	15.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS015015004-SF-4C HEATSINK 15X15X4MM Advanced Thermal Solutions Inc.	189	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	0.591" (15.00mm)	0.590" (15.00mm)	-	0.157" (4.00mm)	-	47.08°C/W @ 200 LFM	-	Aluminum	Black Anodized

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