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Início > Produtos > Ventiladores, Sopradores, Gerenciamento Térmico > Térmico > Dissipadores de Calor

Dissipadores de Calor

Nº da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Série	Embalagem	Status do produto	Tipo	Pacote resfriado	Método de fixação	Forma	Comprimento	Largura	Diâmetro	Altura da aleta	Dissipação de energia @ Aumento de temperatura	Resistência térmica @ Fluxo de ar forçado	Resistência térmica @ Natural	Material	Acabamento do material
HSB12-272706 HEAT SINK, BGA, 27 X 27 X 6 MM Same Sky (Formerly CUI Devices)	1,101	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.236" (6.00mm)	3.8W @ 75°C	7.80°C/W @ 200 LFM	19.59°C/W	Aluminum Alloy	Black Anodized
HSB03-121218 HEAT SINK, BGA, 12 X 12 X 18 MM Same Sky (Formerly CUI Devices)	1,500	-	RFQ	Ficha técnica	HSB	Tray	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.472" (12.00mm)	0.472" (12.00mm)	-	0.709" (18.00mm)	3.1W @ 75°C	9.60°C/W @ 200 LFM	24.01°C/W	Aluminum Alloy	Black Anodized
V8813X HEATSINK TO-220/TOP-3/SOT-32 Assmann WSW Components	3,288	-	RFQ	Ficha técnica	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	1.496" (38.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	-	-	5.00°C/W	Aluminum	Black Anodized
HSB09-212115 HEAT SINK, BGA, 21 X 21 X 15 MM Same Sky (Formerly CUI Devices)	2,583	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.591" (15.00mm)	4.3W @ 75°C	6.00°C/W @ 200 LFM	17.39°C/W	Aluminum Alloy	Black Anodized
ATS-PCBT1095 HEATSINK TO-252 D-PAK COPPER Advanced Thermal Solutions Inc.	2,641	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	TO-252 (DPak)	-	Rectangular, Fins	0.315" (8.00mm)	0.842" (21.40mm)	-	0.400" (10.16mm)	-	21.00°C/W @ 200 LFM	28.00°C/W	Copper	Tin
507222B05300G HEAT SINK Boyd Laconia, LLC	1,149	-	RFQ	Ficha técnica	Hat Section 5070	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.375" (9.53mm)	1.750" (44.45mm)	-	1.470" (37.34mm)	-	-	-	Aluminum	Black Anodized
501200B00000G HEATSINK 14-16 DIP BLACK .19" Boyd Laconia, LLC	1,013	-	RFQ	Ficha técnica	-	Bag	Active	Top Mount	14-DIP and 16-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	0.250" (6.35mm)	0.731" (18.57mm)	-	0.190" (4.83mm)	0.4W @ 30°C	50.00°C/W @ 200 LFM	68.00°C/W	Aluminum	Black Anodized
ATS-PCB1073 HEATSINK TO-263 COPPER Advanced Thermal Solutions Inc.	116,590	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	TO-263 (D²Pak)	-	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	-	0.402" (10.21mm)	-	9.50°C/W @ 200 LFM	18.00°C/W	Copper	Tin
HSS24-B20-NP HEAT SINK, STAMPING, TO-218/TO-2 Same Sky (Formerly CUI Devices)	2,779	-	RFQ	Ficha técnica	HSS	Box	Active	Top Mount	TO-218, TO-220	Bolt On	Rectangular, Fins	1.654" (42.00mm)	1.496" (38.00mm)	-	0.984" (25.00mm)	7.85W @ 75°C	4.30°C/W @ 200 LFM	9.56°C/W	Aluminum Alloy	Black Anodized
V7477W HEATSINK TOP-3 TO-220 SOT-32 Assmann WSW Components	1,624	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.374" (34.90mm)	-	0.500" (12.70mm)	-	-	14.00°C/W	Aluminum	Black Anodized
HSE-B20350-NP HEAT SINK, EXTRUSION, TO-220, 35 Same Sky (Formerly CUI Devices)	1,436	-	RFQ	Ficha técnica	HSE	Tray	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.378" (35.00mm)	1.142" (29.00mm)	-	0.472" (12.00mm)	6.2W @ 75°C	2.91°C/W @ 200 LFM	12.10°C/W	Aluminum Alloy	Black Anodized
HSE-B20380-040H HEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices)	1,254	-	RFQ	Ficha técnica	HSE	Tray	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.496" (38.00mm)	1.378" (35.00mm)	-	0.492" (12.50mm)	7.4W @ 75°C	3.94°C/W @ 200 LFM	10.14°C/W	Aluminum Alloy	Black Anodized
V7466X HEATSINK ALUM ANOD Assmann WSW Components	2,926	-	RFQ	Ficha técnica	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.772" (45.00mm)	-	0.500" (12.70mm)	-	-	7.00°C/W	Aluminum	Black Anodized
V5220W HEATSINK ANOD ALUM W/PIN TO-220 Assmann WSW Components	1,938	-	RFQ	Ficha técnica	-	Tray	Active	Board Level, Vertical	TO-220	Bolt On	Rectangular, Fins	0.984" (25.00mm)	1.260" (32.00mm)	-	0.787" (19.99mm)	-	-	10.00°C/W	Aluminum	Black Anodized
HSB06-181810 HEAT SINK, BGA, 18 X 18 X 10 MM Same Sky (Formerly CUI Devices)	1,111	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.709" (18.00mm)	0.709" (18.00mm)	-	0.394" (10.00mm)	3.2W @ 75°C	18.80°C/W @ 200 LFM	23.68°C/W	Aluminum Alloy	Black Anodized
HSE-B20381-035H HEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices)	394	-	RFQ	Ficha técnica	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.500" (38.10mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	6.5W @ 75°C	3.66°C/W @ 200 LFM	11.54°C/W	Aluminum Alloy	Black Anodized
201835 SILENTSTEPSTICK HEATSINK 14.5 X Watterott Electronic GmbH	175	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	Stepper Motor Driver Board	Thermal Tape, Adhesive (Included)	Rectangular, Fins	0.591" (15.00mm)	0.571" (14.50mm)	-	0.512" (13.00mm)	-	-	-	Aluminum	Black Anodized
508500B00000G HEATSINK 24-PIN DIP GLUE-ON BLK Boyd Laconia, LLC	6,732	-	RFQ	Ficha técnica	-	Bag	Active	Top Mount	24-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	1.250" (31.75mm)	0.530" (13.46mm)	-	0.190" (4.83mm)	1.0W @ 40°C	15.00°C/W @ 500 LFM	34.00°C/W	Aluminum	Black Anodized
V2286B CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	494	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.236" (6.00mm)	-	-	32.00°C/W	Aluminum Alloy	Black Anodized
V7700W HEATSINK ALUM ANOD Assmann WSW Components	8,275	-	RFQ	Ficha técnica	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220	Bolt On	Square, Pin Fins	0.984" (25.00mm)	0.625" (16.00mm)	-	0.630" (16.00mm)	-	-	24.00°C/W	Aluminum	Black Anodized

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