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Início > Produtos > Ventiladores, Sopradores, Gerenciamento Térmico > Térmico > Dissipadores de Calor

Dissipadores de Calor

Nº da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Série	Embalagem	Status do produto	Tipo	Pacote resfriado	Método de fixação	Forma	Comprimento	Largura	Diâmetro	Altura da aleta	Dissipação de energia @ Aumento de temperatura	Resistência térmica @ Fluxo de ar forçado	Resistência térmica @ Natural	Material	Acabamento do material
658-35AB HEATSINK CPU 28MM SQBLK W/O TAPE Wakefield-Vette	13,852	-	RFQ	Ficha técnica	658	Tray	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.350" (8.89mm)	-	3.00°C/W @ 800 LFM	-	Aluminum	Black Anodized
V2268E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	1,929	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.236" (6.00mm)	-	-	30.00°C/W	Aluminum Alloy	Black Anodized
HSE-B20254-040H HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	2,107	-	RFQ	Ficha técnica	HSE	Bag	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.260" (32.00mm)	-	0.551" (14.00mm)	5.7W @ 75°C	7.74°C/W @ 200 LFM	13.16°C/W	Aluminum Alloy	Black Anodized
HSE-B20250-045H HEAT SINK, EXTRUSION, TO-220, 50 Same Sky (Formerly CUI Devices)	868	-	RFQ	Ficha técnica	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	7.7W @ 75°C	4.05°C/W @ 200 LFM	9.74°C/W	Aluminum Alloy	Black Anodized
V2269E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	1,083	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.787" (20.00mm)	0.787" (20.00mm)	-	0.354" (9.00mm)	-	-	27.00°C/W	Aluminum Alloy	Black Anodized
576802B03900G HEATSINK TO220 CLIPON W/TAB.75" Boyd Laconia, LLC	15,144	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
7142DG HEATSINK TO-220 TIN CLIP-ON 21MM Boyd Laconia, LLC	4,435	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level	TO-220	Clip and Board Locks	Rectangular, Fins	0.780" (19.81mm)	0.520" (13.21mm)	-	0.515" (13.08mm)	1.0W @ 30°C	8.00°C/W @ 400 LFM	20.30°C/W	Copper	Tin
HSB26-343408 HEAT SINK, BGA, 33.5 X 33.5 X 8 Same Sky (Formerly CUI Devices)	524	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.319" (33.50mm)	1.319" (33.50mm)	-	0.315" (8.00mm)	4.94W @ 75°C	5.30°C/W @ 200 LFM	15.19°C/W	Aluminum Alloy	Black Anodized
7173DG BOARD LEVEL HEATSINK .375"TO-220 Boyd Laconia, LLC	5,532	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.375" (9.52mm)	1.5W @ 50°C	10.00°C/W @ 200 LFM	25.80°C/W	Copper	Tin
658-45AB HEATSINK CPU 28MM SQBLK W/O TAPE Wakefield-Vette	2,642	-	RFQ	Ficha técnica	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.450" (11.43mm)	3.0W @ 50°C	6.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSE-B250-04H HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	2,215	-	RFQ	Ficha técnica	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.378" (35.00mm)	-	1.000" (25.40mm)	8.0W @ 75°C	3.26°C/W @ 200 LFM	13.60°C/W	Aluminum Alloy	Black Anodized
HSE-B20500-040H HEAT SINK, EXTRUSION, TO-220, 50 Same Sky (Formerly CUI Devices)	727	-	RFQ	Ficha técnica	HSE	Tray	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.969" (50.00mm)	1.378" (35.00mm)	-	0.492" (12.50mm)	8.9W @ 75°C	4.85°C/W @ 200 LFM	8.43°C/W	Aluminum Alloy	Black Anodized
574902B03300G HEATSINK TO-220 VERT MNT W/TAB Boyd Laconia, LLC	5,561	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular	1.375" (34.93mm)	0.860" (21.84mm)	-	0.395" (10.03mm)	2.5W @ 40°C	6.00°C/W @ 400 LFM	16.00°C/W	Aluminum	Black Anodized
651-B HEATSINK 14-16PIN DIP BLK Wakefield-Vette	1,025	-	RFQ	Ficha técnica	651	Bulk	Active	Top Mount	14-DIP and 16-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	0.750" (19.05mm)	0.415" (10.54mm)	-	0.240" (6.10mm)	0.5W @ 40°C	40.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
V5619B HEATSINK ALUM ANOD Assmann WSW Components	3,025	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	24-DIP	Press Fit	Rectangular, Fins	1.299" (32.99mm)	0.748" (19.00mm)	-	0.189" (4.80mm)	-	-	48.00°C/W	Aluminum	Black Anodized
ATS-PCB1029 HEATSINK TO-220 BLACK Advanced Thermal Solutions Inc.	6,605	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.000" (25.40mm)	1.551" (39.40mm)	-	0.374" (9.50mm)	-	6.80°C/W @ 200 LFM	11.00°C/W	Aluminum	Black Anodized
V8813Y HEATSINK TO-220/TOP-3/SOT-32 Assmann WSW Components	399	-	RFQ	Ficha técnica	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	-	-	8.80°C/W	Aluminum	Black Anodized
HSB11-252518 HEAT SINK, BGA, 25 X 25 X 18 MM Same Sky (Formerly CUI Devices)	2,722	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.709" (18.00mm)	5.5W @ 75°C	4.50°C/W @ 200 LFM	13.70°C/W	Aluminum Alloy	Black Anodized
XL25W-12-12-10 CERAMIC HEAT SINK 12X12X10MM WHI t-Global Technology	2,324	-	RFQ	Ficha técnica	XL-25	Bulk	Active	Heat Spreader	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape	Square	0.472" (12.00mm)	0.472" (12.00mm)	-	0.394" (10.00mm)	-	-	-	Ceramic	-
657-15ABPEN HEATSINK TO-220 W/PINS BLK 1.5" Wakefield-Vette	2,871	-	RFQ	Ficha técnica	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.500" (38.10mm)	6.0W @ 38°C	3.30°C/W @ 200 LFM	-	Aluminum	Black Anodized

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