Pesquisas Populares 74ABT74D,112 2N5432-2 M323R8GA3PB0-CTD 900-13636-0010-000 ARDUINO SHIELD SGPC3_SHTC3 ADG452BRUZ AD8630ARUZ RF50S MT25QU01GBBB8E12-0AUT MT53E256M32D2DS-053 AUT:B

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Início > Produtos > Ventiladores, Sopradores, Gerenciamento Térmico > Térmico > Dissipadores de Calor

Dissipadores de Calor

Nº da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Série	Embalagem	Status do produto	Tipo	Pacote resfriado	Método de fixação	Forma	Comprimento	Largura	Diâmetro	Altura da aleta	Dissipação de energia @ Aumento de temperatura	Resistência térmica @ Fluxo de ar forçado	Resistência térmica @ Natural	Material	Acabamento do material
273-AB HEATSINK TO-220 LOW HEIGHT BLK Wakefield-Vette	6,688	-	RFQ	Ficha técnica	273	Bulk	Active	Board Level	TO-220, TO-218	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.375" (9.52mm)	2.0W @ 49°C	7.20°C/W @ 400 LFM	24.50°C/W	Aluminum	Black Anodized
V2016B HEATSINK CPU XCUT Assmann WSW Components	25,739	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.335" (8.50mm)	0.335" (8.50mm)	-	0.315" (8.00mm)	-	-	32.00°C/W	Aluminum Alloy	Black Anodized
290-2AB HEATSINK TO-220 DUAL MNT BLK Wakefield-Vette	6,693	-	RFQ	Ficha técnica	290	Bulk	Active	Board Level	TO-218, TO-202, TO-220 (Dual)	Bolt On	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	2.0W @ 44°C	7.00°C/W @ 400 LFM	22.00°C/W	Aluminum	Black Anodized
V7237C HEATSINK TO-220 19.05X13.21MM Assmann WSW Components	3,624	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.500" (12.70mm)	-	-	21.00°C/W	Aluminum	Black Anodized
V8508G HEATSINK TO-220 15X12.8MM Assmann WSW Components	18,498	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level	TO-220	Press Fit	Rectangular, Fins	0.591" (15.00mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	3.0W @ 60°C	14.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-PCBT1085 HEATSINK TO-220 CLIP-ON Advanced Thermal Solutions Inc.	5,042	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.748" (19.00mm)	0.504" (12.80mm)	-	0.504" (12.80mm)	-	4.40°C/W @ 200 LFM	27.30°C/W	Aluminum	Black Anodized
XL25W-TO247-22-17-1 CERAMIC HEAT SPREADER 22X17MM WH t-Global Technology	1,362	-	RFQ	Ficha técnica	XL-25	Bulk	Active	Heat Spreader	TO-247	Thermal Tape	Rectangular	0.866" (22.00mm)	0.669" (17.00mm)	-	0.039" (1.00mm)	-	-	-	Ceramic	-
579302B00000G HEATSINK TO-220 SNAP-DOWN .75" Boyd Laconia, LLC	8,413	-	RFQ	Ficha técnica	-	Bag	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.750" (19.05mm)	0.980" (24.89mm)	-	0.440" (11.18mm)	3.0W @ 50°C	6.00°C/W @ 500 LFM	16.80°C/W	Aluminum	Black Anodized
HSS-B20-0635H-01 HEATSINK TO-220 2.7W ALUMINUM Same Sky (Formerly CUI Devices)	4,399	-	RFQ	Ficha técnica	HSS	Bag	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.520" (13.20mm)	0.375" (9.53mm)	-	0.748" (19.00mm)	2.7W @ 75°C	9.51°C/W @ 200 LFM	27.78°C/W	Aluminum	Black Anodized
230-75AB HEATSINK TO-220 VERT/HORZ BLK Wakefield-Vette	3,232	-	RFQ	Ficha técnica	230	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.570" (14.47mm)	-	0.500" (12.70mm)	2.0W @ 57°C	7.50°C/W @ 400 LFM	28.50°C/W	Aluminum	Black Anodized
XL25W-TO247-22-17-0.64 CERAMIC HEAT SPREADER 22X17MM WH t-Global Technology	1,614	-	RFQ	Ficha técnica	XL-25	Bulk	Active	Heat Spreader	TO-247	Thermal Tape	Rectangular	0.866" (22.00mm)	0.669" (17.00mm)	-	0.025" (0.64mm)	-	-	-	Ceramic	-
575002B00000G HEATSINK TO-220 TABS BLACK Boyd Laconia, LLC	4,977	-	RFQ	Ficha técnica	-	Bag	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	5.00°C/W @ 400 LFM	13.60°C/W	Aluminum	Black Anodized
217-36CTE6 HEATSINK DPAK SMT TIN PLATED Wakefield-Vette	7,879	-	RFQ	Ficha técnica	217	Bulk	Active	Top Mount	D²Pak (TO-263), SOL-20, SOT-223, TO-220	SMD Pad	Rectangular, Fins	0.740" (18.80mm)	0.600" (15.24mm)	-	0.360" (9.14mm)	1.0W @ 55°C	16.00°C/W @ 200 LFM	55.00°C/W	Copper	Tin
V8508B-L HEATSINK TO-220 19X12.8MM Assmann WSW Components	1,381	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Press Fit and PC Pin	Rectangular, Fins	0.748" (19.00mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	-	-	21.00°C/W	Aluminum	Black Anodized
V8508H HEAT SINK ANOD ALUM TO-220 Assmann WSW Components	2,579	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	TO-220	PC Pin	Square, Pin Fins	0.591" (15.00mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	-	-	26.00°C/W	Aluminum	Black Anodized
HSS-B20-NP-04 HEATSINK TO-220 6.5W ALUMINUM Same Sky (Formerly CUI Devices)	5,572	-	RFQ	Ficha técnica	HSS	Box	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.450" (36.83mm)	1.750" (44.45mm)	-	0.370" (9.40mm)	6.5W @ 75°C	3.76°C/W @ 200 LFM	11.54°C/W	Aluminum	Black Anodized
291-H36AB HEATSINK TO-220 BOLT-ON BLK Wakefield-Vette	5,196	-	RFQ	Ficha técnica	291	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.860" (21.84mm)	1.000" (25.40mm)	-	0.360" (9.14mm)	2.0W @ 68°C	16.00°C/W @ 600 LFM	34.00°C/W	Aluminum	Black Anodized
HSS-B20-NPR-02 HEATSINK TO-220 5.1W ALUMINUM Same Sky (Formerly CUI Devices)	2,648	-	RFQ	Ficha técnica	HSS	Bag	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	0.500" (12.70mm)	1.000" (25.40mm)	-	1.180" (29.97mm)	5.1W @ 75°C	4.20°C/W @ 200 LFM	14.71°C/W	Aluminum	Black Anodized
217-36CTRE6 BOARD LEVEL HEAT SINKS Wakefield-Vette	2,120	-	RFQ	Ficha técnica	217	Tape & Reel (TR)	Active	Top Mount	D²Pak (TO-263), SOL-20, SOT-223, TO-220	SMD Pad	Rectangular, Fins	0.740" (18.80mm)	0.600" (15.24mm)	-	0.360" (9.14mm)	1.0W @ 55°C	16.00°C/W @ 200 LFM	55.00°C/W	Copper	Tin
HSB02-101007 HEAT SINK, BGA, 10 X 10 X 7 MM Same Sky (Formerly CUI Devices)	2,105	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.275" (7.00mm)	2.0W @ 75°C	16.50°C/W @ 200 LFM	37.90°C/W	Aluminum Alloy	Black Anodized

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