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Início > Produtos > Ventiladores, Sopradores, Gerenciamento Térmico > Térmico > Dissipadores de Calor

Dissipadores de Calor

Nº da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Série	Embalagem	Status do produto	Tipo	Pacote resfriado	Método de fixação	Forma	Comprimento	Largura	Diâmetro	Altura da aleta	Dissipação de energia @ Aumento de temperatura	Resistência térmica @ Fluxo de ar forçado	Resistência térmica @ Natural	Material	Acabamento do material
530714B00000G HEATSINK TO-220 LIGHTWEIGHT .5" Boyd Laconia, LLC	1,484	-	RFQ	Ficha técnica	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.710" (18.03mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	2.0W @ 40°C	4.00°C/W @ 700 LFM	20.30°C/W	Aluminum	Black Anodized
HSB30-373710 HEAT SINK, BGA, 37.4 X 37 X 10 M Same Sky (Formerly CUI Devices)	172	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.472" (37.39mm)	1.472" (37.39mm)	-	0.394" (10.00mm)	6.45W @ 75°C	4°C/W @ 200 LFM	11.63°C/W	Aluminum Alloy	Black Anodized
655-53AB HEATSINK CPU 40.6MM SQ H=.525" Wakefield-Vette	3,411	-	RFQ	Ficha técnica	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.522" (13.27mm)	4.0W @ 40°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
V2030B HEATSINK CPU FORGED Assmann WSW Components	564	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.256" (6.50mm)	-	-	6.00°C/W	Aluminum Alloy	Black Anodized
DV-T268-301E-TR HEATSINK FOR TO-268 Ohmite	3,971	-	RFQ	Ficha técnica	D	Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.580" (40.13mm)	-	0.460" (11.68mm)	7.0W @ 35°C	4.00°C/W @ 700 LFM	-	Aluminum	Degreased
504222B00000G HEATSINK TO-220 PWR CLR 1.45"10W Boyd Laconia, LLC	2,583	-	RFQ	Ficha técnica	-	Bag	Active	Board Level	TO-220 (Dual)	Bolt On	Rectangular, Fins	1.450" (36.83mm)	0.780" (19.81mm)	-	0.850" (21.60mm)	4.0W @ 40°C	5.00°C/W @ 200 LFM	6.40°C/W	Aluminum	Black Anodized
M48118B011000G MAX CLIP HEATSINK Boyd Laconia, LLC	6,174	-	RFQ	Ficha técnica	Max Clip System™	Bulk	Active	Board Level, Vertical	TO-126, TO-220, TO-247	Clip and PC Pin	Rectangular, Angled Fins	1.180" (29.97mm)	0.866" (22.00mm)	-	1.516" (38.50mm)	-	-	-	Aluminum	Black Anodized
HSB16-404018 HEAT SINK, BGA, 40 X 40 X 18 MM Same Sky (Formerly CUI Devices)	1,049	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.709" (18.00mm)	9.4W @ 75°C	2.60°C/W @ 200 LFM	7.96°C/W	Aluminum Alloy	Black Anodized
580100B00000G HEATSINK SLIDE-ON 8-DIP Boyd Laconia, LLC	574	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	8-DIP	Press Fit, Slide On	Rectangular, Fins	0.562" (14.27mm)	0.600" (15.24mm)	-	0.450" (11.43mm)	1.0W @ 30°C	8.00°C/W @ 500 LFM	30.00°C/W	Aluminum	Black Anodized
HSB40-252510P HEAT SINK, BGA, 25 X 25 X 10 MM, Same Sky (Formerly CUI Devices)	346	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	4.2W @ 75°C	6.00°C/W @ 200 LFM	17.87°C/W	Aluminum Alloy	Black Anodized
576602B00000G HEATSINK TO-220 VERT MNT .95" Boyd Laconia, LLC	3,037	-	RFQ	Ficha técnica	-	Bag	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.950" (24.13mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	9.00°C/W @ 200 LFM	16.60°C/W	Aluminum	Black Anodized
TGH-0220-03 ALUMINIUM HEAT SINK 22X22MM t-Global Technology	670	-	RFQ	Ficha técnica	TGH	Bulk	Active	Top Mount	-	-	Square, Pin Fins	0.866" (22.00mm)	0.866" (22.00mm)	-	0.354" (9.00mm)	-	-	-	Aluminum	Black Anodized
507222B00000G HEATSINK TO-220 DUAL 10W Boyd Laconia, LLC	339	-	RFQ	Ficha técnica	Hat Section 5070	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.470" (37.34mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	8.0W @ 70°C	3.00°C/W @ 200 LFM	9.60°C/W	Aluminum	Black Anodized
V4330K HEATSINK ANOD ALUM Assmann WSW Components	2,003	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level	KLP	Bolt On	Rectangular, Fins	1.476" (37.50mm)	1.142" (29.00mm)	-	0.472" (12.00mm)	-	-	11.00°C/W	Aluminum	Black Anodized
E2A-T220-38E BLACK ANODIZED HEATSINK Ohmite	144	-	RFQ	Ficha técnica	EX	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	0.641" (16.28mm)	0.642" (16.30mm)	-	1.500" (38.10mm)	3.0W @ 50°C	5.00°C/W @ 200 LFM	14.00°C/W	Aluminum	Black Anodized
FA-T220-51E HEATSINK TO-218,TO-220,TO-247 Ohmite	1,499	-	RFQ	Ficha técnica	F	Box	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	4.0W @ 20°C	2.00°C/W @ 300 LFM	3.40°C/W	Aluminum	Black Anodized
V8818V HEATSINK ALUM ANOD Assmann WSW Components	488	-	RFQ	Ficha técnica	-	Tray	Active	Board Level	SOT-32, TO-220	Bolt On and PC Pin	Rectangular, Fins	2.362" (60.00mm)	0.748" (19.00mm)	-	0.844" (21.44mm)	-	-	7.50°C/W	Aluminum	Black Anodized
658-25ABT3 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	3,605	-	RFQ	Ficha técnica	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
HSB17-404025 HEAT SINK, BGA, 40 X 40 X 25 MM Same Sky (Formerly CUI Devices)	596	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.984" (25.00mm)	11.7W @ 75°C	2.10°C/W @ 200 LFM	6.41°C/W	Aluminum Alloy	Black Anodized
HSB27-434316 HEAT SINK, BGA, 43.1 X 43.1 X 16 Same Sky (Formerly CUI Devices)	916	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.697" (43.10mm)	1.697" (43.10mm)	-	0.650" (16.51mm)	8.98W @ 75°C	2.80°C/W @ 200 LFM	8.35°C/W	Aluminum Alloy	Black Anodized

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